B.I.C SN/Ag/Cu Solder compositions are available in below ratios:
14, 16, 18 , 20 , 22 , 23 swg
No Clean / Resin Core
2.5%, 2.8%, 3.0%
The RoHS directive is aimed at restricting the use of 6 hazardous materials in the manufacture of electrical and electronic devices as follows: